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- 2 SMA lines, expertly operated
- Selective Soldering -Through hole mounting
- Solder paste Inspection <0,0015mm3
- Automatic Optical Inspection
- High resolution X-ray (Dage XD7500 0,95 micron 1200X Mag)
- Lead Free Process
- BGA, uBGA, CSP - 0.3mm pitch
- Flip Chip, Package on Package
- Passive – 01005 (0,4x0,2 mm)
- Spacing 6 mil (0,152mm)
- Advanced Hot Air Rework, wiring
- Rebuild and Modifying of PBA
- Underfill
- Conformal coating and molding
- Depenalization- Routing, Punch and V-cut
Box build
- Flexible capacity, samples to volume manufacturing
- Troubleshoot, analysis, repair
- Advanced modifications
- Build To Order processes
- Unique experience in manufacturing transfer projects
- Multiple assembly lines/cells including test, troubleshoot and repair
- Lean & Kaizen Methodology
- Cost reduction (process, material, output)
- Reports and statistics
Engineering services (DFM)
- Panel layout
Design and optimization of production panels - Special investigations
Typical Roth Cause Analyze - Process development
Production process specification - New technology
Follow and lead new technology implementation - Design of soldering surface
Optimizing soldersurfaces and solderpaste for SMT components - Fabrication analysis PCB
Proposal of design improvments - Assembly analysis PBA
Proposal of design improvments
